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Available Sizes. FEPA/ANSI F12-F1200, JIS #12-#4000, other grain sizes upon request . Appliion. It is suitable for cutting and grinding solar silicon chips, semiconductor silicon chips and quatz chips, crystal polishing, ceramic and special Silicon Carbide Abrasive precision polishing, as well as non-metallic materials such as glass, stone, agate, high-grade jewelry and jade.

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