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Grind more welds with a long-lasting grinding wheel. Use the before-and-after slider to see how 3M™ Cubitron™ II Depressed Center Grinding Wheels take down a ¾” submerged arc weld. Since this premium grinding wheel is …

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-11-21 · Ceramic Aluminium Oxide. Often referred to as just “Ceramic”, Norton Quantum’s patented ceramic form of aluminium oxide is harder and sharper than conventional abrasive grains. This ceramic grain has a unique microcrystalline structure that is self-sharpening. This ultimately reduces the regularity that the grinding wheel needs dressing ...

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The TAIKO process is the name of a wafer back grinding process. This method is different to conventional back grinding. When grinding the wafer, the TAIKO process leaves an edge (approximately 3 mm) on the outer most circumference of the wafer and thin grinds only the inner circumference. By using this method, it lowers the risk of thin wafer ...

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-5-10 · When the SiC was ground by diamond grinding wheel under the same conditions, the S a value rose from 0.6 to 1.2 μm, and the S z value rose from 5.2 to 10.1 μm. It indied that the roughness values of the orthogonal surface were obviously better than parallel/perpendicular surface and SiC. On the parallel/perpendicular surface, the bonding ...

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